JPH0250637B2 - - Google Patents
Info
- Publication number
- JPH0250637B2 JPH0250637B2 JP11846985A JP11846985A JPH0250637B2 JP H0250637 B2 JPH0250637 B2 JP H0250637B2 JP 11846985 A JP11846985 A JP 11846985A JP 11846985 A JP11846985 A JP 11846985A JP H0250637 B2 JPH0250637 B2 JP H0250637B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- plating layer
- main body
- copper
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 42
- 239000002699 waste material Substances 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 26
- 239000011889 copper foil Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 3
- 238000009751 slip forming Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 9
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846985A JPS61276396A (ja) | 1985-05-31 | 1985-05-31 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846985A JPS61276396A (ja) | 1985-05-31 | 1985-05-31 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61276396A JPS61276396A (ja) | 1986-12-06 |
| JPH0250637B2 true JPH0250637B2 (en]) | 1990-11-02 |
Family
ID=14737440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11846985A Granted JPS61276396A (ja) | 1985-05-31 | 1985-05-31 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61276396A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI423282B (zh) | 2005-12-22 | 2014-01-11 | Ngk Spark Plug Co | 電容器與配線板及其製造方法 |
| JP5559717B2 (ja) * | 2011-02-01 | 2014-07-23 | 日本特殊陶業株式会社 | 電子部品の製造方法 |
-
1985
- 1985-05-31 JP JP11846985A patent/JPS61276396A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61276396A (ja) | 1986-12-06 |
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